Thermomechanical vibration of PCB and component assembly - Université de technologie de Troyes Access content directly
Conference Papers Year : 2018

Thermomechanical vibration of PCB and component assembly

Abstract

This study investigates the effect of vibration loading. A tow dimensional finite element model of the printed circuit board (PCB) and the plastic ball grid array (PBGA) component assembly is released to investigate the effect of harmonic excitation on the solder ball response.
No file

Dates and versions

hal-02572200 , version 1 (13-05-2020)

Identifiers

  • HAL Id : hal-02572200 , version 1

Cite

Ayda Halouani, Mariem Miladi Chaabane, Mohamed Haddar, Abel Cherouat. Thermomechanical vibration of PCB and component assembly. Second International Conference on Acoustics and Vibration, Mar 2018, Hammamet, Tunisia. ⟨hal-02572200⟩
41 View
0 Download

Share

Gmail Mastodon Facebook X LinkedIn More